product
slf
characteristic
●excellent soldering reliability, dimensional stability and chemical resistance
●low dk/df
●excellent mechanical and electrical properties .
●halogen free, flammability ul94 vtm-0.
●compatible with eu rohs directive, free of pb,hg,cd, cr6 ,pbb,pbde, etc..
application area
computer, mobile phone, digital camera, vcr, flat panel display, apparatus and instrument, automotive electronics, etc..
- product performance
- product certificate
- data download
|
test item |
test method |
unit |
ipc standard |
typical value |
|
slf 1012ss |
||||
|
peel strength 90° |
ipc-tm-650,no.2.4.9 method a |
n/mm |
≥0.53 |
0.92 |
|
surface adhesion (with pure adhesive) |
企标q/gdsy 6058.26. 2.4.9.3 |
n/mm |
- |
0.54 |
|
thermal stress |
ipc-tm-650,no.2.4.13 |
- |
pass |
pass |
|
dimensional stability |
ipc-tm-650,no.2.2.4 method b |
% |
±0.15 |
md: -0.0682 td: -0.0585 |
|
chemical resistance |
ipc-tm-650,no.2.3.2 |
% |
≥80 |
＞95 |
|
moisture absorption |
ipc-tm-650,no.2.6.2 |
% |
≤2 |
0.46 |
|
volume resistivity |
ipc-tm-650,no.2.5.17 |
mω-cm |
≥106 |
2.54×108 |
|
surface resistance |
ipc-tm-650,no.2.5.17 |
mω |
≥105 |
3.68×106 |
|
10ghz dielectric constant |
iec-61189-2-721 |
- |
≤3.8 |
3.2 |
|
10ghz dissipation factor |
iec-61189-2-721 |
- |
≤0.01 |
0.0032 |
|
mit |
jis c 6471 r0.38×4.9n |
times |
- |
＞200 |
|
dielectric strength |
ipc-tm-650,no.2.5.6.1 |
v/μm |
≥100 |
187 |
remarks:
explanations: certified to ipc-4204/25 copper clad adhesiveless,cast and cured polyimide